motherboard lga 775 d33006 gigabyte ga965pdq6

This was done to avoid the reputed danger of the heat sinks/fans of pre-built computers falling off in transit. With LGA 775, the heat dissipation interface is connected directly to the motherboard on four points, compared with the two connections of the Socket 370 and the 'clamshell' four-point connection of the Socket 478.

This socket also introduces a new method of connecting the heat dissipation interface to the chip surface and motherboard. The force from the load plate ensures that the processor is completely level, giving the CPU's upper surface optimal contact with the heat sink or cold-water block fixed onto the top of the CPU to carry away the heat generated by the CPU. Intel Core 2 Duo E7500 2.93 GHz installed into LGA 775 socket All chipsets for superseding sockets were exclusively designed and manufactured by Intel, a practice later also adopted by AMD when they first launched APUs in 2011 ( Socket AM3+ processors, also launched in 2011, were usually paired with motherboard with AMD chipsets, but some motherboards using third-party chipsets were also manufactured, usually with Nvidia chipsets, as the Socket AM3+ design was directly extended from the earlier Socket AM3 design). Nvidia was the last third-party manufacturer of LGA 775 chipsets (its final product was MCP7A family, marketed as GeForce 9300/9400, launched in October 2008), as other third-parties discontinued their products earlier. LGA 775 was the last Intel socket for desktops for which third-party companies manufactured chipsets. Such heat-sinks are not interchangeable with heatsinks for sockets that have a distance of 75 mm, such as LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. (some of the processors listed here might not work on newer Intel based chipsets)įor LGA 775, the distance between the screw-holes for the heatsink is 72 mm.

Motherboard lga 775 d33006 gigabyte ga965pdq6